Device Comprising an Encapsulated Microsystem and Production Method Thereof

摘要

This invention discloses a process for manufacturing a device ( 44 ) comprising a packaged microsystem ( 10 '): the device manufactured according to the invention is in the form of a plane wafer, the microsystem ( 10 ') being buried in the wafer. Therefore, the process according to the invention is used to make a compound that may be used as a basis for other micro technology processes. Moreover, the process according to the invention co-integrates electronic compounds ( 36, 38 ) when the device ( 44 ) is being manufactured. The device ( 44 ) according to the invention is particularly suitable for MEMS, and particularly radiofrequency resonators.