| 摘要 |
A heat-dissipating substrate is manufactured by densifying and then cross-rolling an alloy composite of CuMo or CuW, comprising Cu and coarse-grain Mo or coarse-grain W, whereby the maximum value of the linear expansion coefficient from room temperature to 800°C in any direction within the plane parallel to the surface of the substrate is 10 ppm/K or less, and the thermal conductivity thereof at 200°C is 250 W/m∙K or more. |
