发明名称 APPARATUS FOR PROBING DIE ELECTRICITY AND METHOD FOR FORMING THE SAME
摘要 5 A method of forming an apparatus for probing die electricity, which determines areinforcement structure according to features of a converting plate, and combines the converting plate, reinforcement structure and a substrate for forming the apparatus for probing die electricity. In an embodiment, the apparatus for probing die electricity further comprises a substrate, a converting plate, a needle module and a reinforcement 10 structure. The converting plate comprises two opposite surfaces respectively having a plurality of first and second conductive elements. The needle module comprises a plurality of needles respectively and electrically connected to the plurality second conductive elements. The reinforcement structure is disposed between the converting plate and the substrate.15Figure 2A for publication
申请公布号 SG10201604652W(A) 申请公布日期 2016.07.28
申请号 SG10201604652W 申请日期 2012.12.07
申请人 MPI CORPORATION 发明人 LEE, CHUNG-TSE;WU, CHIEN-CHOU;CHAN, YI-MING
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