| 摘要 |
PROBLEM TO BE SOLVED: To improve heat radiation efficiency.SOLUTION: A semiconductor device of an embodiment comprises: a housing; a first substrate which is housed in the housing and has a first surface, a second surface located on the side opposite to the first surface and an opening which pierces the first surface and the second surface; a control part which is provided on the first substrate and has a third surface facing the second surface; a storage part provided on the second surface; a connection part which is provided on the third surface and thermally connected with the control part; a conductive part which is provided on the third surface and electrically connecting the control part and the substrate; and a first heat transfer member which contacts the connection part and pierces the substrate through the opening and thermally connects the housing and the control part.SELECTED DRAWING: Figure 1 |
