发明名称 LASER PROCESSING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a laser processing device capable of reducing or dispensing with a replacement frequency of a laser receiving part for receiving a laser of passing through a through-hole, in processing of the through-hole by the laser.SOLUTION: In a laser processing device for processing an injection hole 98 in a nozzle body 93 of a fuel injection valve by using a laser Lz0, a laer irradiation part irradiates the laser Lz0 for processing the injection hole 98 to the nozzle body 93 from the outer wall side of the nozzle body 93 held by a work chuck. The laser Lz0 of passing through the injection hole 98 is received by a laser receiving part 135 provided in the nozzle body 93. A surface of the laser receiving part 135 is formed in an irregular shape, and when the laser Lz0 processes the injection hole 98, debris generated in the nozzle body 93 sticks. When the laser receiving part 135 receives the laser Lz0, the debris sticking to a surface of the laser receiving part 135 evaporates.SELECTED DRAWING: Figure 4
申请公布号 JP2016172272(A) 申请公布日期 2016.09.29
申请号 JP20150053777 申请日期 2015.03.17
申请人 DENSO CORP 发明人 YASUDA KOICHIRO;SHIRAI HIDEAKI;ISSHIKI YUTARO
分类号 B23K26/70;B23K26/16;B23K26/382;F02M61/18 主分类号 B23K26/70
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