发明名称 PHOTO/MOISTURE CURABLE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a photo/moisture curable resin composition which has excellent adhesiveness, heat insulation performance, weight reduction, and stress relaxation performance.SOLUTION: The photo/moisture curable resin composition contains a radically polymerizable compound, a moisture-curable urethane resin, a photo-radical polymerization initiator, and hollow particles.SELECTED DRAWING: None
申请公布号 JP2016199668(A) 申请公布日期 2016.12.01
申请号 JP20150080366 申请日期 2015.04.09
申请人 SEKISUI CHEM CO LTD 发明人 YUKI AKIRA;TAKAHASHI TORU;KIDA TAKUMI;MIKI TAKASHI
分类号 C08G18/10;C08F290/06;C08G18/67;C09J4/00;C09J11/04;C09J11/06;C09J175/04 主分类号 C08G18/10
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