发明名称 PRE-LAYER DEFECT SITE REVIEW USING DESIGN
摘要 A system and method to image a layer of a wafer based on a coordinate of a defect in a pre-layer of the wafer are disclosed. A design file for the current layer can be aligned to the wafer using an image of the current layer. A design file for a previous layer can be aligned to the design file for the current layer.
申请公布号 US2016371831(A1) 申请公布日期 2016.12.22
申请号 US201615183919 申请日期 2016.06.16
申请人 KLA-TENCOR CORPORATION 发明人 YATI Arpit
分类号 G06T7/00 主分类号 G06T7/00
代理机构 代理人
主权项 1. A system comprising: a defect review tool, wherein the defect review tool includes: a stage configured to clamp a wafer; andan image generation system configured to generate an image of a layer of a surface of the wafer; and a controller configured to communicate with the defect review tool, wherein the controller is configured to: align a design file for a current layer of the wafer to an image of the current layer;align a design file for a previous layer of the wafer to the design file for the current layer, wherein the previous layer is formed prior to the current layer; andidentify a region of the image of the current layer based on a coordinate of a defect in the previous layer, wherein the region corresponds to the coordinate of the defect in the previous layer.
地址 Milpitas CA US