| 摘要 |
PROBLEM TO BE SOLVED: To provide an optical communication package that is mounted with a laser diode in which heat generated from a package itself is reduced, thereby light is output and operation characteristics are not deteriorated. SOLUTION: An optical communication package 10 has a window-frame cutout 15 provided on the sidewall of the frame 12 of a metallic base 11 of which the bottom plate 13 and the frame 12 make an inside into a cavity 14 for mounting an electronic component, and has a feed-through substrate 16 in a manner of closing the cutout. The feed-through substrate 16 outside the base 11 has bonding pads 21 for bonding to external connection terminals 20 of Cu base metal plates, the feed-through substrate 16 inside the base 11 has bonding pads 22 for conduction to the electronic component via bonding wires, and a first conductor wiring pattern 23 is provided for connecting them to each together. In addition, a second conductor wiring pattern 26 that becomes in a conduction state through a via conductor 24 and/or castellation conductor 25 is provided on a lower layer. COPYRIGHT: (C)2006,JPO&NCIPI
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