MICROCHIP ASSEMBLY PRODUCED BY TRANSFER MOLDING

摘要

The invention relates to a microchip assembly and an associated general production process, wherein an originally unshaped first component (1) is forged against the surface of a transfer molding form by an injected molten second component (5). The first component (1) may particularly comprise electrical tracks (3) on a carrier layer, said carrier layer being removed after the solidification of the injected material. According to a preferred embodiment, a microchip (8) is bonded to the electrical tracks (3) and then embedded in a filling (10). The electrical tracks (3) preferably lead from the front side (11) of the microchip (8) to the back side of the assembly, where they can be connected to external circuits. A sensitive front side (11) of a sensor microchip (8) can thus be placed very close to the front plane of the whole assembly, making the assembly apt for biosensor applications.