发明名称 ELECTRONIC APPARATUS
摘要 <p><P>PROBLEM TO BE SOLVED: To provide an electronic apparatus which is improved in cooling efficiency of heating components. <P>SOLUTION: The electronic apparatus 1 comprises a housing 6 with an opening 18, partition wall 14 which marks out the interior of the housing 6 into a first chamber 12 and a second chamber 13 which is opened to the outside the housing 6 through the opening 18, first and second heating components 33 and 34 mounted in the first chamber 12, first heat dissipation member 25 arranged inside the second chamber 13, heat transfer member 36 for transferring the heat from the first heating component 33 to the first heat dissipation member 25, cooling fan 24 which is arranged in the second chamber 13 and takes in the outside air through the opening 18 while at the same time discharging the outside air toward the first heat dissipation member 25, second heat dissipation member 62 which is exposed outside the housing 6 and is thermally connected to the second heating component 34, and cover 7 which is attached to the housing 6 and covers the opening 18 and the second heat dissipation member 62. The cover 7 forms, between itself and the housing 6, a space S which communicates with the second chamber 12 and wherein the outside air is caused to flow. <P>COPYRIGHT: (C)2008,JPO&INPIT</p>
申请公布号 JP2007324339(A) 申请公布日期 2007.12.13
申请号 JP20060152286 申请日期 2006.05.31
申请人 TOSHIBA CORP 发明人 HONGO TAKESHI
分类号 H05K7/20;G06F1/20 主分类号 H05K7/20
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