发明名称 |
Rinsing Wafers Using Composition-Tunable Rinse Water in Chemical Mechanical Polish |
摘要 |
An apparatus for manufacturing integrated circuits on a wafer includes a polish pad; a rinse arm movable over the polish pad; and a post-polish cleaner. The post-polish cleaner includes a brush for brushing the wafer; and a nozzle aiming at the wafer. The apparatus further includes a mixer configured to mix an additive and di-ionized water; and a pipe connecting the mixer to at least one of the rinse arm and the nozzle.
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申请公布号 |
US2010018029(A1) |
申请公布日期 |
2010.01.28 |
申请号 |
US20080179347 |
申请日期 |
2008.07.24 |
申请人 |
CHAN CHENG HSUN;HO MING-CHE |
发明人 |
CHAN CHENG HSUN;HO MING-CHE |
分类号 |
B23P17/00 |
主分类号 |
B23P17/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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