发明名称 Methods of forming a pattern of a semiconductor device
摘要 In a method of forming a pattern of a semiconductor device, a hard mask layer is formed on a substrate. A photoresist film is coated on the hard mask layer. The photoresist film is exposed and developed to form a first photoresist pattern. A smoothing process is performed on the first photoresist pattern to form a second photoresist pattern having a roughness property lower from that of the first photoresist pattern. In the smoothing process, a surface of the first photoresist pattern is treated with an organic solvent. An ALD layer is formed on a surface of the second photoresist pattern. The ALD layer is anisotropically etched to form an ALD layer pattern on a sidewall of the second photoresist pattern. The hard mask layer is etched using the second photoresist pattern and the ALD layer pattern as an etching mask to form a hard mask pattern.
申请公布号 US9520289(B2) 申请公布日期 2016.12.13
申请号 US201414519813 申请日期 2014.10.21
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 Park Jin;Koh Cha-Won;Kim Hyun-Woo
分类号 G03F7/38;H01L21/027;G03F7/26;H01L21/033;H01L21/3105;H01L21/02 主分类号 G03F7/38
代理机构 F. Chau & Associates, LLC 代理人 F. Chau & Associates, LLC
主权项 1. A method of forming a pattern of a semiconductor device, the method comprising: forming a hard mask layer on a substrate; coating a photoresist film on the hard mask layer; exposing and developing the photoresist film to form a first photoresist pattern; performing a smoothing process on the first photoresist pattern to form a second photoresist pattern having a roughness property lower than that of the first photoresist pattern, wherein a surface of the first photoresist pattern is treated with an organic solvent during the smoothing process, and wherein the smoothing process includes heating the substrate having the first photoresist pattern thereon to a temperature of about 80° C. to about 120° C. and spraying a vaporized organic solvent onto the first photoresist pattern; forming an atomic layer deposition (ALD) layer on a surface of the second photoresist pattern; anisotropically etching the ALD layer to form an ALD layer pattern on a sidewall of the second photoresist pattern; and etching the hard mask layer using the second photoresist pattern and the ALD layer pattern as an etching mask to form a hard mask pattern.
地址 Suwon-Si, Gyeonggi-Do KR