| 摘要 |
The purpose of the present invention is to provide a mounting position correction method and a mounting position correction device with which a mounting position for an electronic component can be appropriately corrected even if a localized deformation is caused in a substrate. Specifically, a method for correcting the mounting position of an electronic component with respect to a deformed substrate F comprises: a small region setting step of dividing an arbitrary region of a substrate F having a plurality of reference points into a plurality of small regions E (i) each of which includes a plurality of reference points A(i)...; a reference point position measuring step of measuring actual reference point positions of the plurality of reference points A(i)...; a deformation amount calculation step of calculating, from a predetermined theoretical reference point position and the actual reference point positions, a movement amount, an expansion/contraction amount, and a rotation angle of each of the small regions E(i); and a mounting position correction step of correcting, from the movement amount M(ΔXa(i), ΔYa(i)), the expansion/contraction amount Q(i)x, the expansion/contraction amount Q(i)y, and the rotation angle θ(i) of the small regions, a predetermined theoretical mounting position P(Xp(i), Yp(i)) of an electronic component. |
