| 发明名称 |
WIRING BOARD |
| 摘要 |
A wiring board includes: thin silver wires formed on a substrate by a printing method, in which the thin silver wires are configured so that the width thereof in a cross-section in a direction perpendicular to a wire length direction thereof is 20 μm or less, a top thereof has a smaller width than that of a contact portion that comes into contact with the substrate, and a volume resistivity of the thin silver wire is 15 μΩ·cm or less. |
| 申请公布号 |
US2016330835(A1) |
申请公布日期 |
2016.11.10 |
| 申请号 |
US201515110977 |
申请日期 |
2015.01.23 |
| 申请人 |
TOPPAN FORMS CO., LTD. |
发明人 |
Hirose Kumi;Sekiguchi Takuya;Nawa Nariaki |
| 分类号 |
H05K1/09;H05K3/12;G06F3/041;H05K1/02 |
主分类号 |
H05K1/09 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A wiring board comprising:
thin silver wires formed on a substrate by a printing method, wherein a width of the thin silver wire in a cross-section in a direction perpendicular to a wire length direction thereof is 20 μm or less, and a top thereof has a smaller width than that of a contact portion that comes into contact with the substrate, and a volume resistivity of the thin silver wire is 15 μΩ·cm or less. |
| 地址 |
Tokyo JP |
