发明名称 METHOD FOR DETERMINING QUALITY OF POLYIMIDE FILM, COPPER-CLAD LAMINATE SHEET USING POLYIMIDE FILM AND METHOD FOR MANUFACTURING FLEXIBLE WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a method for determining the quality of a polyimide film for flexible wiring boards for manufacturing a flexible wiring board having a small warp and torsion, a high yield thereby and high productivity.SOLUTION: The method for determining the quality of a polyimide film is used for a flexible wiring board having a metal layer laminated on the polyimide film. The polyimide film has MD and TD directions orthogonal in the flat surface thereof. In the polyimide film, an orientation angle of molecules in a plane showing the maximum orientation being the maximum value obtained by measuring orientation in the flat surface is 0 degree or more and 30 degrees or less in the absolute value of a difference between the TD and MD directions of the polyimide film, and a surface orientation degree ratio of the front to the rear of the polyimide film is less than 1.0.SELECTED DRAWING: Figure 1
申请公布号 JP2016205967(A) 申请公布日期 2016.12.08
申请号 JP20150086972 申请日期 2015.04.21
申请人 SUMITOMO METAL MINING CO LTD 发明人 IGARI ATUSHI
分类号 G01N21/23;B32B15/08;G01N33/44;H05K1/03 主分类号 G01N21/23
代理机构 代理人
主权项
地址