发明名称 |
MODULE WITH BUILT-IN COMPONENT AND METHOD FOR MANUFACTURING MODULE |
摘要 |
A module with a built-in component is produced by disposing a cavity on a mounting surface side of a ceramic multilayer substrate, storing a circuit component therein and, thereafter, performing resin molding. A second resin portion is disposed on the mounting surface side of the ceramic multilayer substrate so as to continuously cover a frame-shaped portion and a first resin portion molded. External terminal electrodes are disposed on an outer surface of the second resin portion.
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申请公布号 |
US2006284300(A1) |
申请公布日期 |
2006.12.21 |
申请号 |
US20060462395 |
申请日期 |
2006.08.04 |
申请人 |
MURATA MANUFACTURING CO., LTD. |
发明人 |
NISHIZAWA YOSHIHIKO;SAKAI NORIO |
分类号 |
H01L23/24;H01L23/13;H01L23/538 |
主分类号 |
H01L23/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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