| 发明名称 |
METHOD FOR SECURING A COMPONENT TO A SUBSTRATE. |
| 摘要 |
The present invention relates to a method for securing an electronic component to a substrate, using a solder paste which contains a mixture of organic dicarboxylic acids, the thickness of the solder deposits being 25 to 200 µ. |
| 申请公布号 |
MX2016007749(A) |
申请公布日期 |
2016.12.12 |
| 申请号 |
MX20160007749 |
申请日期 |
2014.12.12 |
| 申请人 |
HERAEUS DEUTSCHLAND GMBH & CO. KG |
发明人 |
Jens NACHREINER;Joachim WIESE;Sebastian FRITZSCHE |
| 分类号 |
B23K35/26;B23K35/02;B23K35/36;H05K3/34 |
主分类号 |
B23K35/26 |
| 代理机构 |
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