发明名称 PLASMA PROCESSING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a plasma processing apparatus with which generation of plasma is stably maintained and active species can speedily be generated when performing a plasma processing on a work where a processing region is discontinuously set. <P>SOLUTION: The plasma processing apparatus 1 is provided with a pair of electrodes 2 and 3, a power supply circuit 7, a gas supply means 8, a plasma supply opening 5 and a control means 170. The apparatus can be switched to a non-processing mode where plasma is generated and plasma is maintained by stopping supply of a raw gas of the gas supply means 8 by the control means 170 in a state where carrier gas is supplied to plasma generation space 30, and to a processing mode where the raw gas is activated to generate the active species, and the active species is blown out from the plasma supply opening 5 and a face to be processed 101 of the work 10 is plasma-processed by supplying a mix gas of carrier gas and raw gas to plasma generation space 30. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008227108(A) 申请公布日期 2008.09.25
申请号 JP20070062685 申请日期 2007.03.12
申请人 SEIKO EPSON CORP 发明人 ASUKE SHINTARO
分类号 H01L21/3065;C23C16/50;H05H1/24 主分类号 H01L21/3065
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