Wiring board and method for manufacturing wiring board

摘要

A wiring board includes a substrate including first insulation layers, a second insulation layer on the first layers, a third insulation layer on the second layer, and a plain conductor on the third layer. The substrate has inductor forming portion in which inductor patterns are formed on the first layers and first via conductors formed in the first layers such that the first via conductors connect the inductor patterns through the first layers, the substrate has a land on the second layer and a second via conductor in the second layer such that the second via conductor connects the land and the outermost inductor pattern, the substrate has a third via conductor in the third layer such that the third via conductor connects the plain conductor and land and has the central axis passing through the center of the third via conductor inside projected region of the second via conductor.

主权项

1. A wiring board, comprising:
a substrate comprising a plurality of first insulation layers, a plurality of second insulation layers formed on the outermost first insulation layers of the first insulation layers, respectively, a plurality of third insulation layers formed on the second insulation layers, respectively, and a plurality of plain conductors formed on the third insulation layers, respectively, wherein the substrate has an inductor forming portion in which a plurality of inductor patterns is formed on the plurality of first insulation layers, respectively, and a plurality of first via conductors formed in the first insulation layers, respectively, such that the first via conductors are connecting the inductor patterns through the first insulation layers, the substrate has a plurality of land structures formed on the second insulation layers, respectively, and a plurality of second via conductors formed in the second insulation layers, respectively, such that the plurality of second via conductors is connecting the land structures and the outermost inductor patterns of the inductor patterns, respectively, the substrate has a plurality of third via conductors formed in the third insulation layers, respectively, such that the plurality of third via conductors is connecting the plain conductors and the land structures, respectively, and each has a central axis passing through the center of each of the third via conductors inside a projected region of a respective one of the second via conductors and that the plurality of outermost inductor patterns of the inductor patterns is formed in the substrate such that the outermost inductor patterns are separated 100 μm or more from the plain conductors, respectively.