发明名称 Heat-resistant adhesive sheet
摘要 It is an object of the present invention to provide a heat-resistant adhesive sheet for suppressing fluctuation in dimensional stability of a flexible printed board or, in particular, of a two-layer flexible printed board which has recently been increasingly demanded and which is required to be more highly heat-resistant and reliable. The foregoing problems can be solved by a heat-resistant adhesive sheet having a heat-resistant adhesive layer, containing a thermoplastic polyimide, which is provided on at least one surface of an insulating layer containing a non-thermoplastic polyimide, the heat-resistant adhesive sheet having a stretching of not more than 10 mm at one side thereof.
申请公布号 US2009155610(A1) 申请公布日期 2009.06.18
申请号 US20060991220 申请日期 2006.09.01
申请人 KANESHIRO HISAYASU;KIKUCHI TAKASHI;MATSUWAKI TAKAAKI 发明人 KANESHIRO HISAYASU;KIKUCHI TAKASHI;MATSUWAKI TAKAAKI
分类号 C09J7/02;B32B15/08;B32B27/34;C09J179/08 主分类号 C09J7/02
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