| 摘要 |
[Problem] To provide a positive-acting photosensitive resin composition with which high-sensitivity pattern formation is possible, while maintaining adhesion during developing, and with which it is possible to form a cured film with minimal in-pattern residue. [Solution] A positive-acting photosensitive resin composition containing component (A), component (B), component (C) and solvent (D) below. Component (A): an alkali-soluble acrylic copolymer obtained by copolymerizing (A1) to (A4) below: (A1) unsaturated carboxylic acid and/or unsaturated carboxylic acid anhydride, (A2) monomer having a phenolic hydroxy group and a polymerizable unsaturated group, (A3) a monomer having a hydroxyalkyl group and a polymerizable unsaturated group, and (A4) an N-substituted maleimide compound. Component (B): 1,2-quinonediazido compound. Component (C): crosslinking agent. (D) solvent. |
