| 摘要 |
Provided is a method for manufacturing a resin-sealed semiconductor device having improved reliability. This semiconductor device manufacturing method is provided with: a step for respectively mounting one or more semiconductor elements on a plurality of semiconductor element mounting regions on a wiring board; a step for forming, before or after mounting the semiconductor elements, grooves in the wiring board, said grooves being formed along dicing lines; and a step for dividing into semiconductor devices by, after the semiconductor elements are mounted, batch-sealing the semiconductor element-mounted surface of the wiring board, the grooves, and the semiconductor elements using a mold resin, then, by performing, along the dicing line, dicing with a cutting width that is smaller than that of the grooves. |
