LIGHT-EMITTING DEVICE

摘要

An object is to provide a light emitting device with which thermal resistance between an LED chip and a mounting substrate can be reduced. A light emitting device (B1) includes a protruding structure (16) that protrudes from a side of a surface (12a) of a second conductive semiconductor layer (12) of an LED chip (1a) toward a side of a surface (22a) of a second conductor portion (22) of a mounting substrate (2a) so as to contact the surface (22a) of the second conductor portion (22), and is positioned so as to extend around an outer periphery of a second electrode (15). A first electrode (14) and a first conductor portion (21) are joined to each other by a first joint portion (31), and a second joint portion (32) that joins the second electrode (15) and the second conductor portion (22) to each other fills a space (3) surrounded by the second electrode (15), the protruding structure (16), and the second conductor portion (22). The protruding structure (16) is disposed to extend around the outer periphery of the second electrode (15) so as to surround the second joint portion (32) in planar view. A part of the mounting substrate (2a) that overlaps the protruding structure (16) in planar view is either identical in height to or lower than a part of the second conductor portion (22) that is joined to the second joint portion (32).