| 发明名称 |
Substrate-to-carrier adhesion without mechanical adhesion between abutting surfaces thereof |
| 摘要 |
Wafer to carrier adhesion without mechanical adhesion for formation of an IC. In such formation, an apparatus has a bottom surface of a substrate abutting a top surface of a support platform without adhesive therebetween. A material is disposed around the substrate and on the top surface of the support platform. The material is in contact with a side surface of the substrate to completely seal an interface as between the bottom surface of the substrate and the top surface of the support platform to retain abutment of the top surface and the bottom surface. |
| 申请公布号 |
US2016247764(A1) |
申请公布日期 |
2016.08.25 |
| 申请号 |
US201615143077 |
申请日期 |
2016.04.29 |
| 申请人 |
Invensas Corporation |
发明人 |
Haba Belgacem;Mohammed Ilyas |
| 分类号 |
H01L23/538;H01L25/065;H01L23/31 |
主分类号 |
H01L23/538 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An apparatus, comprising:
a substrate; a support platform; wherein a bottom surface of the substrate abuts a top surface of the support platform without adhesive therebetween; a material disposed around the substrate and on the top surface of the support platform; wherein the material is in contact with a side surface of the substrate to completely seal an interface as between the bottom surface of the substrate and the top surface of the support platform to retain abutment of the top surface and the bottom surface. |
| 地址 |
San Jose CA US |
