| 摘要 |
PROBLEM TO BE SOLVED: To provide a film deposition apparatus capable of depositing a film while heating a film substrate surface to a heat-resistant temperature or more, adjusting a temperature distribution of a film substrate in film deposition even in a limited space of a deposition room, and improving a property of a thin film to be formed.SOLUTION: A film deposition apparatus 1 includes: a vacuum evacuation mechanism; a rolling-out roll 11 to roll out a rolled film substrate 4; a taking-up roll 19 to take out the film substrate 4; a temperature adjusted roll 15 arranged between the rolling-out roll 11 and the taking-up roll 19; and a film deposition mechanism to the film substrate 4 arranged on both sides facing the temperature adjusted roll 15 of the film substrate 4 transported. The film deposition apparatus 1 includes a magnetron sputtering cathode 21 for depositing a film on the film substrate 4, and lamp heaters 20, 22 before and after the sputtering cathode to heat the film substrate 4 from a front surface side, at least one of the lamp heaters having a reflector capable of changing an irradiation angle, and deposits the film continuously while the film substrate 4 is heated.SELECTED DRAWING: Figure 1 |
