| 摘要 |
PROBLEM TO BE SOLVED: To provide: a probe substrate that can improve the fixing strength of a substrate and a thin film pad and increase reliability and durability; and a method of manufacturing the same.SOLUTION: A probe substrate comprises: a substrate 10; a seed layer 30 disposed on the top face of the substrate; a plating layer 40 disposed on the seed layer and configured to have a smaller area than the seed layer; and a solder layer 50 connected to the top face of the plating layer. Also provided is a method of manufacturing the same. Thereby, the invention can reduce influence of an under cut of the seed layer and prevent deterioration of the fixing strength caused by chemical attack between processes.SELECTED DRAWING: Figure 1 |
