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发明名称
Appending apparatus of an adhesive tape for package of Micro semiconductor parts
摘要
申请公布号
KR200379643(Y1)
申请公布日期
2005.03.23
申请号
KR20040036979U
申请日期
2004.12.28
申请人
发明人
分类号
H01L21/52;(IPC1-7):H01L21/52
主分类号
H01L21/52
代理机构
代理人
主权项
地址
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