发明名称 |
IC INTERCONNECT FOR HIGH CURRENT |
摘要 |
IC interconnect for high current device, design structure thereof and method are disclosed. One embodiment of the IC interconnect includes a first via positioned in a dielectric and coupled to a high current device at one end; a buffer metal segment positioned in a dielectric and coupled to the first via at the other end thereof; and a plurality of second vias positioned in a dielectric and coupled to the buffer metal segment at one end and to a metal power line at the other end thereof, wherein the buffer metal segment is substantially shorter in length than the metal power line. |
申请公布号 |
US2009152724(A1) |
申请公布日期 |
2009.06.18 |
申请号 |
US20070954866 |
申请日期 |
2007.12.12 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
WANG PING-CHUAN;WATSON KIMBALL M.;XIU KAI |
分类号 |
H01L23/52;H01L21/4763 |
主分类号 |
H01L23/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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