| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which is suitable for downsizing and achieves good heat radiation performance.SOLUTION: A semiconductor device according to the invention includes: semiconductor elements 12, 14; a mold resin 24 covering the semiconductor elements 12, 14; and a metal plate 32 provided on the mold resin 24 and positioned above the semiconductor elements 12, 14. A first through hole 34 penetrating through the metal plate 32 and the mold resin 24 is provided in a thickness direction of the mold resin 24.SELECTED DRAWING: Figure 1 |
