LED module

摘要

An LED module includes: an LED chip; and a resin case having a reflective surface surrounding the LED chip. An area contact inhibitor to inhibit area contact with an adjacent LED module is formed on an outer surface of the resin case.

主权项

1. An LED module, comprising:
an LED chip; a resin case having a reflective surface formed on an inner side of the resin case to surround the LED chip; a mounting member having a mounting surface on which the LED chip is mounted; and an area contact inhibitor configured to inhibit area contact with an adjacent LED module, wherein the area contact inhibitor is formed on four outer sides of the resin case, and the area contact inhibitor includes a pair of opposite first side regions and a pair of opposite second side regions, wherein each of the first side regions and the second side regions includes a first planar portion and a second planar portion which is different from the first planar portion and is located farther from the mounting member than the first planar portion, wherein a first angle between the first planar portion and the mounting surface is smaller than a second angle between the second planar portion and the mounting surface, wherein the first planar portion, when viewed from a cross-sectional view, extends at least from a same plane as a bottom surface of a recessed portion of the resin case in a first direction towards the LED chip from the bottom surface of the recessed portion such that an end of the first planar portion extends along a side and beyond a height of the LED chip, and wherein the first planar portion is inclined to be closer to the LED chip in a direction perpendicular to a normal direction of the mounting surface as the first planar portion becomes farther from the mounting surface in the normal direction and the second planar portion extends in the normal direction of the mounting surface.