| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device that has a base substrate with a high heat radiation property for heat quantity generated from a semiconductor element and with rigidity.SOLUTION: A semiconductor device according to an embodiment comprises a base substrate, and a semiconductor element arranged on the base substrate. On the base substrate, at least in a region where the semiconductor element is arranged, a hole part is formed so that an area of an opening increases as it goes from a side where the semiconductor element is arranged toward an opposite side direction. The base substrate includes a material having a higher thermal conductivity than the circumference, in the hole part.SELECTED DRAWING: Figure 2 |
