| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method which can easily inhibit deformation of a wire at low cost in a semiconductor device (encapsulation object) in which a plurality of wires having different wire layouts from each other are formed.SOLUTION: A manufacturing method of a semiconductor device in which an encapsulation object 8 including semiconductor elements 1a, 1b connected by wires 3a, 3b, respectively, and including lead frames 2a, 2b is encapsulated by an encapsulation body comprises: a process of arranging the encapsulation object inside a metal mold 20; a process of arranging rectification members 30a, 30b inside the metal mold 20 so as not to contact the wires 3a, 3b; and a process of introducing a fluid material to become the encapsulation body inside the metal mold 20 in a state where the rectification members 30a, 30b are arranged and subsequently encapsulating the encapsulation object 8 by the encapsulation body by solidifying the material. In the process of arranging the rectification members 30a, 30b, the rectification members 30a, 30b are arranged so as to extend from an interior wall of the metal mold 20, in which a distance h1 from the interior wall to each tip of the rectification members 30a, 30b is longer than a distance h2 from the interior wall to each of the wires 3a, 3b. |
