PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

摘要

Provided is a package structure including a circuit board, a plurality of first contact pads, a plurality of metal pillars and at least one chip. The first contact pads are disposed on the circuit board. The chip is disposed on one portion of the first contact pads. The metal pillars are disposed on the other portion of the first contact pads, where the chip is surrounded by the metal pillars. A method for manufacturing the package structure is also provided.