| 摘要 |
An illumination apparatus includes a heat sink having a circuit-mounting side provided with a heat-conductive insulating film thereon. A lighting device includes a printed circuit provided on the circuit-mounting side of the heat sink and in thermal contact with the heat-conductive insulating film, and a lighting unit having a light emitting diode that is in the form of a chip die, that is connected electrically and wiredly to the printed circuit and that is in thermal contact with the heat-conductive insulating film.
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