| 摘要 |
This contact pin unit for housing an IC package in a detachable manner and electrically connecting the IC package to a circuit board comprises: contact pins (26), each having one end that contacts the IC package and another end that contacts the circuit board; and contact pin frames (36), each comprising a plate body along the surface of which a plurality of grooves (36b) are formed in parallel, said frames being stacked in the plate thickness direction (D2) in the state where the contact pins (26) are arranged along the insides of the grooves (36b) with the one end and other end protruding outward from the plate bodies. Further, among a front surface (36a) and a back surface (36c) of the contact pin frames (36) that are adjacent in the stacked state and abut against each other in the stacking direction, microprotrusions (36k) which collapse when the stacked contact pin frames (36) are compressed in the stacking direction (D2) are formed in a portion of the front surface (36a). |
