| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate treatment device and the like capable of mounting a substrate at a correct position even if there is dislocation between a mounting base and the substrate carried into a treatment vessel and for promptly coping with the displacement which is caused in the substrate separated from the mounting base after treatment. SOLUTION: Before a wafer W (substrate) is delivered from an external carrier device to a mounting base 3, a detection head unit 22 is shifted from an evacuation position to a detection position, and a plasma treatment device 1 receives position dislocation information between a current position where the wafer W is held by the carrier device 6, and a predetermined position where the wafer is delivered. Based on the position dislocation information, the delivery position of the wafer W is corrected by the carrier device 6 so that the amount of the dislocation of the current position of the wafer W and the predetermined position are settled into an allowable range. COPYRIGHT: (C)2008,JPO&INPIT
|
