| 摘要 |
PROBLEM TO BE SOLVED: To provide a support jig capable of obtaining a sufficient pattern resolution, resolution ability, and detection sensitivity for a miniaturized semiconductor device, in a backside analysis of the semiconductor device, and a failure analysis method. SOLUTION: There is provided a support jig of a semiconductor device used in failure analysis for observing luminescence emitted through the observed part of the backside of the semiconductor device, in a state of applying a probe onto the surface of the semiconductor device. The support jig includes a contact coming in contact with a region excluding the observed part of the backside of the semiconductor device and a support, with one end side fixed to the contact and the other end side fixed to a part other than the semiconductor device. The contact is moved relatively to a wafer, so that the center of the contact approximately coincides with the center of the probe in analysis. COPYRIGHT: (C)2008,JPO&INPIT
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