SEMICONDUCTOR CHIP PACKAGE, MANUFACTURING METHOD THEREOF, AND ELECTRONIC ELEMENT COMPRISING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor chip package for improved solder jointing reliability.

SOLUTION: The semiconductor chip package includes: a semiconductor chip 110 comprising an active surface provided with a bonding pad, a rear surface counter to the active surface, and a side surface; a molding extension part 111 which encloses the side surface and rear surface of the semiconductor chip; a re-wiring pattern 114 that is electrically connected to the bonding pad and extends to the molding extension part 111; a bump solder ball 116 provided on the re-wiring pattern 114; and a molding layer 120c formed so that a part of the bump solder ball 116 is exposed while covering the active surface of the semiconductor chip and the molding extension part 111.

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