| 摘要 |
PROBLEM TO BE SOLVED: To provide a carrier ring for depositing films which produces fewer particles and reduces downtime caused thereby, and also reduces time in alignment and inhibits pedestal damage.SOLUTION: A carrier ring 200 has an annular disk shape, and has an upper carrier ring surface that extends from an outer edge side to a wafer 101 edge side. The wafer edge side includes a lower carrier ring surface that is lower than the upper carrier ring surface, and also includes a plurality of contact support structures. Each contact support structure is located at an edge of the lower carrier ring surface and has a height that is between the lower carrier ring surface and the upper carrier ring surface, and has tapered edges and corners. A step is defined between the upper carrier ring surface and the lower carrier ring surface, such that a top facing edge is disposed at the top of the step and a lower inner edge is disposed at the bottom of the step. Each of the top facing edge and the lower inner edge have a rounded non-sharp edge, and a top of each of the contact support structures is configured for contact with a bottom edge surface of a wafer for lifting, lowering and moving the wafer.SELECTED DRAWING: Figure 1 |
