发明名称 SEMICONDUCTOR ARRANGEMENT AND METHOD FOR MANUFACTURING THE SAME
摘要 A semiconductor arrangement and a method for manufacturing the same. An arrangement may include a bulk semiconductor substrate; a fin formed on the substrate; a first FinFET and a second FinFET formed on the substrate. The first FinFET comprises a first gate stack intersecting the fin and a first gate spacer disposed on sidewalls of the first gate stack. The second FinFET includes a second gate stack intersecting the fin and a second gate spacer disposed on sidewalls of the second gate stack; a dummy gate spacer formed between the first FinFET and the second FinFET and intersecting the fin; an isolation section self-aligned to a space defined by the dummy gate spacer. The isolation section electrically isolates the first FinFET from the second FinFET; and an insulation layer disposed under and abutting the isolation section.
申请公布号 US2016268392(A1) 申请公布日期 2016.09.15
申请号 US201414411073 申请日期 2014.01.16
申请人 INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES 发明人 ZHU Huilong
分类号 H01L29/66;H01L21/762;H01L29/78 主分类号 H01L29/66
代理机构 代理人
主权项 1. A semiconductor arrangement, comprising: a bulk semiconductor substrate; a fin formed on the substrate; a first FinFET and a second FinFET formed on the substrate, wherein the first FinFET comprises a first gate stack intersecting the fin and a first gate spacer disposed on sidewalls of the first gate stack, the second FinFET comprises a second gate stack intersecting the fin and a second gate spacer disposed on sidewalls of the second gate stack; a dummy gate spacer formed between the first FinFET and the second FinFET and intersecting the fin; an isolation section self-aligned to a space defined by the dummy gate spacer, wherein the isolation section electrically isolates the first FinFET from the second FinFET; and an insulation layer disposed under and abutting the isolation section.
地址 Beijing CN