发明名称 |
STACKED DAMASCENE STRUCTURES FOR MICROELECTRONIC DEVICES |
摘要 |
A microelectronic device includes a dual-damascene interconnect structure and a single-damascene line structure directly on the dual-damascene interconnect structure. The dual-damascene interconnect structure and the single-damascene line structure may each include multiple line segments that are arranged in a brick wall pattern. The brick wall pattern may also be used with two or more single-damascene line structures. Various microelectronic devices and related fabrication methods are described. |
申请公布号 |
US2016268199(A1) |
申请公布日期 |
2016.09.15 |
申请号 |
US201514691336 |
申请日期 |
2015.04.20 |
申请人 |
LEE Ki-Don;Kim Jinseok |
发明人 |
LEE Ki-Don;Kim Jinseok |
分类号 |
H01L23/528;H01L23/532;H01L23/58;H01L23/522 |
主分类号 |
H01L23/528 |
代理机构 |
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代理人 |
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主权项 |
1. A microelectronic device comprising:
a microelectronic substrate; a dual-damascene interconnect structure on the microelectronic substrate, the dual-damascene interconnect structure comprising a conductive via and a first conductive line directly on the conductive via opposite the microelectronic substrate; and a single-damascene line structure directly on the dual-damascene interconnect structure, the single-damascene line structure comprising a second conductive line on the first conductive line opposite the conductive via. |
地址 |
Austin TX US |