SEMICONDUCTOR PACKAGES HAVING SEMICONDUCTOR CHIPS DISPOSED IN OPENING IN SHIELDING CORE PLATE

摘要

A semiconductor package includes a first plate having a through hole therein, at least one interconnection layer disposed on a first surface of the first plate, and at least one semiconductor chip disposed on the at least one interconnection layer in a space defined by the through hole and electrically connected to the least one interconnection layer. The package further includes a second plate disposed on the at least one semiconductor chip and a second surface of the first plate on a side of the first plate opposite the first surface, and at least one conductive pad disposed on the second surface of the first plate and electrically connected to the at least one interconnection layer.

主权项

1. A semiconductor package comprising:
a core having a through hole therein; at least one interconnection layer disposed on a first surface of the core; at least one semiconductor chip disposed on the at least one interconnection layer in a space defined by the through hole and electrically connected to the least one interconnection layer; a conductive layer extending continuously across an entire length of the at least one semiconductor chip and disposed on the at least one semiconductor chip such that the at least one semiconductor chip is disposed between the interconnection layer and the conductive layer; and at least one conductive pad disposed on a second surface of the core and electrically connected to the at least one interconnection layer.