| 摘要 |
PROBLEM TO BE SOLVED: To provide a curable composition capable of forming a cured material excellent in flexibility, transparency, chemical resistance and bonding property to a substrate. SOLUTION: This curable composition contains a diene-based polymer having hydroxy or carboxy group and a part or the whole of it is hydrogenated, an epoxysilicone having≤300 epoxy equivalent, an acid anhydride and a curing catalyst. It is preferable not to contain a polysilsesquioxane having oxetanyl group. COPYRIGHT: (C)2006,JPO&NCIPI
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