| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin-packaging mold which does not require adjustment of gate, even if the kind of resin or molding condition is changed, and can prevent failures caused by resin packaging, such as generation of voids or deformation of wires, etc. SOLUTION: Melted resin put into a pot 13 is supplied to a cavity 11, wherein semiconductor chips are arranged via a main supply passage 15 and a sub supply passage 16, and a resin accumulation chamber 12 is connected to the downstream end of the main supply chamber 15. In such a resin packaging mold, an accumulation-side supply passage 17, connecting the main supply passage and the resin accumulation chamber, is made larger in length than in the sub supply passage, and the sectional shapes of both supply passages are made the same as those of each other. Furthermore, the capacity of the resin accumulation chamber is made equivalent or more to those of the cavities. COPYRIGHT: (C)2008,JPO&INPIT
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