| 摘要 |
PROBLEM TO BE SOLVED: To provide a high frequency circuit package and a sensor module capable of ensuring shield of high frequency circuits or isolation among plural high frequency circuits with a simple structure using no lid at low cost.SOLUTION: A first resin board has plural tip-open probes each of which is connected to a microstrip line formed on the rear surface layer, and the front end of which is formed on the rear surface layer being enclosed by a first ground conductor. A second resin board has plural waveguides each of which is formed at a position opposing to the front-open probe in a board lamination direction. In the vicinity of the respective tip-open probes and the waveguides, plural conductivity connection members are disposed being interposed by a space of 1/4 or less of a free space propagation wavelength of a high frequency signal.SELECTED DRAWING: Figure 2 |
