发明名称 PROCESS FOR WAFER BACKSIDE POLYMER REMOVAL, AND WAFER FRONT SIDE SCAVENGER PLASMA
摘要 PROBLEM TO BE SOLVED: To provide a process for removing polymer from the backside of a workpiece. SOLUTION: In this process, a workpiece is supported at its backside with the annular peripheral portion of the backside exposed in a vacuum chamber, and gas flow is confined to the outer edge of the workpiece wchich forms a gap of about 1% of the diameter of the chamber, so that a boundary between an upper process zone containing the frontside of the workpiece and a lower process zone containing the backside is provided. A first plasma is generated in a lower external chamber from a polymer etch precursor gas, and an etchant by-product is introduced from the first plasma into the lower process zone. A second plasma is generated in an upper external plasma chamber from a precursor gas of a scavenger of the etchant by-product, and scavenger species are introduced from the second plasma into the upper process zone. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008227466(A) 申请公布日期 2008.09.25
申请号 JP20080016828 申请日期 2008.01.28
申请人 APPLIED MATERIALS INC 发明人 COLLINS KENNETH S;HANAWA HIROJI;NGUYEN ANDREW;AJIT BALAKRISHNA;PALAGASHVILI DAVID;CRUSE JAMES P;SUN JENNIFER Y;TODOROW VALENTIN N;RAUF SHAHID;RAMASWAMY KARTIK;SCHNEIDER GERHARD M;YOUSIF IMAD;SALINAS MARTIN JEFFREY
分类号 H01L21/3065;G03F7/42;H01L21/027 主分类号 H01L21/3065
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