| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a package component which can prevent malfunction of an electronic component to be mounted in a package and can simplify inspection for checking the connection with a substrate, and to provide an electronic instrument equipped with the same and a manufacturing method of the package component. <P>SOLUTION: A plurality of metal bumps 4 are formed on a base 15 of a package body 3, and a plurality of leads 5 are projected outward from side surfaces 16 continuing to the base 15 of the package body 3. The package body 3 is provided with: a plurality of the metal bumps 4 so that the same electric information needed for operating an integrated circuit element 1 is given to the integrated circuit element 1 through a plurality of the metal bumps 4; and, an interconnecting means 6 for connecting terminal of an integrated circuit element 1 electrically so as to connect the connecting terminals which remains after excluding those which are electrically connected to the metal bumps 4; out of a plurality of the connecting terminals of the integrated circuit element 1, and a plurality of the leads 5. <P>COPYRIGHT: (C)2009,JPO&INPIT |
