| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device capable of improving connection reliability of a solder bump; and its manufacturing method. <P>SOLUTION: This semiconductor device 100 is characterized by comprising: a semiconductor chip 32; a plurality of solder bumps electrically connecting the semiconductor chip 32 to the outside; and metal bumps 20 formed on surfaces of first solder bumps 10 being at least a part of the plurality of solder bumps, and formed of a metal having a melting point higher than that of the first solder bump 10. The metal bumps 20 become cores in melting the first solder bumps 10, whereby wettability of the first solder bumps 10 is improved. <P>COPYRIGHT: (C)2009,JPO&INPIT |
