| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide insulation between neighboring wiring lines on a resin protrusion. <P>SOLUTION: The semiconductor device includes: a semiconductor substrate 10 on which an integrated circuit 12 is formed; a plurality of electrodes 14 electrically connected to the integrated circuit 12 formed on the semiconductor substrate 10; a passivation film 16 formed on the semiconductor substrate 10 with an opening part for exposing at least a part of each electrodes 14; a resin protrusion 18 disposed on the passivation film 16; and a plurality of wiring lines 20 extending from a plurality of electrodes 14 onto the resin protrusion 18 and disposed at intervals from each other on the resin protrusion 18. For each of the wiring line 20, the width positioning on the uppermost part of the resin protrusion 18 is formed to be narrower than the part from either of the electrodes 14 to the front of the uppermost edge. <P>COPYRIGHT: (C)2009,JPO&INPIT |
