| 发明名称 |
PRODUCTION METHOD OF SEMICONDUCTOR DEVICE AND COLLET CHUCK |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device in which high reliability and cost reduction are achieved. <P>SOLUTION: This production method comprises: lifting a semiconductor element 11 located on one main face of a dicing sheet 20 from the other main face of the dicing sheet 20; locating a collet chuck 100 adjacently over the lifted semiconductor element 11; spraying a gas to the surface of the semiconductor element 11 and discharging the gas; peeling the semiconductor element 11 from the dicing sheet 20 while retaining the semiconductor element 11 on the collet chuck 100; and mounting the semiconductor element 11 on a supporting member while retaining the semiconductor element 11 on the collet chuck 100. According to this production method, high reliability of a semiconductor device is achieved. <P>COPYRIGHT: (C)2009,JPO&INPIT |
| 申请公布号 |
JP2009049127(A) |
申请公布日期 |
2009.03.05 |
| 申请号 |
JP20070212886 |
申请日期 |
2007.08.17 |
| 申请人 |
FUJITSU MICROELECTRONICS LTD |
发明人 |
KATO SADATANE;FUJISAWA TETSUYA;KUBOTA YOSHIHIRO;SAWAHATA KOJI;IMAMURA TAKESHI;NISHIMURA TAKAO;AOKI HIROSHI;AIBA YOSHITAKA;MORIYA SUSUMU;MAKINO YUTAKA;MISAWA HIROSHI |
| 分类号 |
H01L21/52;H01L21/301;H01L21/67 |
主分类号 |
H01L21/52 |
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